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Información tecnológica

versión On-line ISSN 0718-0764

Resumen

LISPERGUER, J. H  y  BECKER, P. H. Thermal Analysis and Adhesive Properties of Phenol-Resorcinol-Formaldehyde Resins. Inf. tecnol. [online]. 2005, vol.16, n.6, pp. 27-31. ISSN 0718-0764.  http://dx.doi.org/10.4067/S0718-07642005000600005.

A study is presented on the relation between thermal curing characteristics and adhesive properties of two laboratory-synthesized phenol-resorcinol-formaldehyde resins (PRF) having different resorcinol contents. Resin curing was evaluated using differential scanning calorimetry (DSC), and adhesive properties were tested in laminated Pinus radiata beams impregnated with copper, chromium, and arsenic (CCA) salts. The PRF resins having the higher resorcinol content (25%) showed a single exothermic peak at 94°C, and its adhesive joints showed high resistance to traction and delaminating tests. Resin with lower resorcinol content (15%) showed a double exothermic peak at 99°C and 158°C, with good traction resistance but low resistance in delaminating tests, showing values over the 5% limit required by the norm.

Palabras clave : strength of materials; adhesive resins; phenol-resorcinol-formaldehyde; thermal analysis.

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